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Marking Solutions - Ultimus 300
 

Ultimus 300
  • Automatic Wafer Backside Die Marking system
  • Capable of processing up to 12-inch wafer
For more enquires, kindly contact:

   
 
Marking Solutions
 

Input Handling : Stack Magazine
Output Handling : Stack Magazine
 
LH100ST

Input Handling : Slotted Magazine
Output Handling : Slotted Magazine
 
LH100SP

Input Handling : Stack / Slotted Magazine
Output Handling : Stack / Slotted Magazine
 
LH100 Combi

Input Handling :
JEDEC / EIAJ Tray
Output Handling : JEDEC / EIAJ Tray
 
TH800 Vix

Input Handling : Wafer
Output Handling : Wafer
 
Ultimus 300

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