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Marking Solutions - Ultimus 300
 

Ultimus 300
  • Automatic Wafer Backside Die Marking system
  • Capable of processing up to 12-inch wafer
For more enquires, kindly contact:

   
 
Marking Solutions
 
LH100SP
Input Handling : Slotted Magazine
Output Handling : Slotted Magazine
 
LH2000
Input Handling : Stack / Slotted Magazine
Output Handling : Stack / Slotted Magazine
 
TH800 Vix
Input Handling :
JEDEC Tray
Output Handling : JEDEC Tray
 
Ultimus 300
Input Handling : Wafer
Output Handling : Wafer
 

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